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US 2016/0096727 A1Published application
Integrated circuit package method
AssigneeTexas Instruments Incorporated
InventorsMatthew David Romig, Marie-Solange Anne Milleron, Benjamin Michael Sutton
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Abstract
A method of forming a packaged electronic device includes fabricating a MEMS structure, such as a BAW structure, on a first semiconductor wafer substrate; forming a cavity in a second semiconductor wafer substrate; and mounting the second substrate on the first substrate such that the MEMS structure is positioned inside the cavity in the second substrate using epoxy die attachment film. A wafer level assembly and an integrated circuit package are also described.
Claims12
A method of forming a wafer level package comprising:
- fabricating a BAW structure on a first semiconductor wafer substrate;
- forming a cavity in a second semiconductor wafer substrate;
- and
- mounting the second substrate on the first substrate such that the BAW structure is positioned inside the cavity in the second substrate using epoxy die attachment film.
1 more element
12-20. (canceled)
Dependencies are inferred from the claim text.