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US 2016/0096726 A1Published application
MEMS Device and Method of Making a MEMS Device
AssigneeInfineon Technologies AG
InventorsAlfons Dehe, Martin Wurzer, Christian Herzum
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Abstract
A MEMS device and a method of making a MEMS device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a counter electrode, wherein the moveable electrode and the counter electrode are mechanically connected to the substrate. The movable electrode is configured to stiffen an inner region of the movable membrane.
Claims20
A semiconductor device comprising:
- a substrate;
- a moveable electrode comprising a corrugation line, the corrugation line configured to stiffen an inner region of the moveable electrode;
- and
- a first counter electrode, wherein the moveable electrode and the first counter electrode are mechanically connected to the substrate.
1 more element
A MEMS structure comprising:
- a substrate;
- a moveable electrode comprising radial corrugation lines in an inner region and circular corrugation lines in an outer region;
- and
- a first perforated counter electrode comprising first ridges, wherein the moveable electrode and the first perforated counter electrode are mechanically connected to the substrate.
1 more element
A method of making an electrode of a MEMS device, the method comprising:
- forming trenches in a first sacrificial layer, each trench has substantially the same depth;
- forming a second sacrificial layer lining a top surface of the first sacrificial layer, sidewalls and a bottom surface of the trenches;
- forming a conductive material layer over a top surface of the second sacrificial layer and filling the trenches;
- removing a first portion of the first sacrificial layer forming a first spacer;
- and
- removing a second portion of the second sacrificial layer forming a second spacer thereby exposing the conductive material layer.
3 more elements
A method of making an electrode of a MEMS device, the method comprising:
- forming a first sacrificial layer over a substrate;
- forming mesas in the first sacrificial layer;
- forming a second sacrificial layer over the mesas;
- forming a conductive layer over the second sacrificial layer and the mesas;
- removing a first portion of the substrate forming a first spacer;
- removing a second portion of the second sacrificial layer forming a second spacer;
- and
- removing the mesas.
5 more elements
Dependencies are inferred from the claim text.