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US 2016/0096724 A1Published application
Stress isolation for mems device
AssigneeFreescale Semiconductor, Inc.
InventorsCHAD S. DAWSON, STEPHEN R. HOOPER
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AssigneeFreescale Semiconductor, Inc.
InventorsCHAD S. DAWSON, STEPHEN R. HOOPER
Estimating the term…
A microelectromechanical systems (MEMS) die includes a substrate having a recess formed therein and a cantilevered platform structure. The cantilevered platform structure has a platform and an arm extending from the platform, wherein the platform and arm are suspended over the recess. The arm is fixed to the substrate and is a sole attachment point of the platform to the substrate. A MEMS device resides on the platform. Fabrication methodology entails forming the recess in the substrate, with the recess extending inwardly from a surface of the substrate, and attaching a structural layer over the recess and over the surface of the substrate. The MEMS device is formed on the structural layer and the structural layer is removed around a perimeter of the platform and the arm to form the cantilevered platform structure.
A microelectromechanical systems (MEMS) die comprising:
A microelectromechanical systems (MEMS) die comprising:
A method of making a microelectromechanical systems (MEMS) die comprising:
Dependencies are inferred from the claim text.