Cap and Substrate Electrical Connection at Wafer Level
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorJung-Huei Peng
Life of this patent
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Abstract
A cap and substrate having an electrical connection at a wafer level includes providing a substrate and forming an electrically conductive ground structure in the substrate and electrically coupled to the substrate. An electrically conductive path to the ground structure is formed in the substrate. A top cap is then provided, wherein the top cap includes an electrically conductive surface. The top cap is bonded to the substrate so that the electrically conductive surface of the top cap is electrically coupled to the path to the ground structure.
Claims20
A device comprising:
- an electrically conductive ground structure disposed in a first substrate, wherein the electrically conductive ground structure extends completely through the first substrate to a second substrate such that the electrically conductive ground structure physically contacts the second substrate;
- a conductive layer interposed between the first substrate and the second substrate, wherein the conductive layer physically contacts the conductive ground structure;
- and
- a third substrate eclectically coupled to the second substrate through the ground structure.
The device of claim 8, further comprising a conductive plug extending completely through the first substrate to the second substrate such that the conductive plug physically contacts the conductive layer.
A device comprising:
- a conductive ground structure disposed in a first semiconductor substrate, wherein the electrically conductive ground structure extends through the first substrate to a second semiconductor substrate such that the electrically conductive ground structure physically contacts the second semiconductor substrate;
- a conductive layer disposed between the first and second semiconductor substrates;
- and
- a conductive plug extending through the first substrate to the conductive layer such that the conductive plug physically contacts the conductive layer.
A semiconductor device comprising:
- a substrate;
- an electrically conductive ground structure in the substrate and electrically coupled to the substrate;
- an electrically conductive path to the ground structure in the substrate;
- and
- a top cap, wherein the top cap includes an electrically conductive surface, and wherein the top cap is bonded to the substrate so that the electrically conductive surface of the top cap is electrically coupled to the path to the ground structure.
Dependencies are inferred from the claim text.