Selection of Polishing Parameters to Generate Removal or Pressure Profile

A computer program product for selecting values for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head including a plurality of controllable chambers to apply controllable chamber pressures to a plurality of corresponding zones on a substrate, comprising the computer program product tangibly encoded on a non-transitory storage device, operable to cause a processor to perform operations comprising:

• for each controllable parameter of the plurality of controllable parameters, storing data relating variation in removal profile on a front surface of the substrate to variation in the controllable parameter, wherein the plurality of controllable parameters include a chamber pressure for each chamber of the plurality of chambers, wherein the data for each chamber pressure includes removal at a plurality of positions on the front surface of the substrate inside a zone corresponding to the chamber, and wherein the data for at least one controllable parameter of the plurality of controllable parameters includes removal at multiple positions inside each of at least two zones corresponding to at least two chambers of the plurality of chambers;
• determining a value for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on the front surface of the substrate to variation in the parameters for each chamber such that the expected removal profile for at least some positions within a respective zone from the plurality of zones includes an effect of the chamber pressure for the chamber corresponding to the respective zone and an effect of the at least one controllable parameter other than the chamber pressure for the chamber corresponding to the respective zone;
• and
• storing the value for each parameter of the plurality of controllable parameters.

A computer program product for selecting values for a plurality of independently controllable chamber pressures of a carrier head in a chemical mechanical polishing system, the carrier head including a plurality of controllable chambers to apply the independently controllable chamber pressures to a plurality of corresponding zones on a substrate, the computer program product tangibly encoded on a non-transitory storage device, operable to cause a processor to perform operations comprising:

• for each chamber of the plurality of controllable chambers, store data relating variation in removal profile on a front surface of the substrate to variation of the controllable chamber pressure of the chamber, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers, the plurality of positions including positions inside a zone corresponding to the chamber and positions outside the zone corresponding to the chamber;
• determine a value of a chamber pressure for each chamber of the plurality of controllable chambers to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on the front surface of the substrate to variation in the chamber pressure for each chamber such that the expected removal profile for at least some positions within a respective zone from the plurality of zones includes an effect of the chamber pressure for the chamber corresponding to the respective zone and an effect of the chamber pressure for a chamber that does not correspond to the respective zone;
• and
• store the value for each chamber pressure of the plurality of controllable chamber pressures.