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US 2016/0096250 A1Published application
Adjusting a substrate polishing condition
AssigneeEbara Corporation
InventorsYasuyuki MOTOSHIMA, Toru MARUYAMA
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Abstract
A polishing apparatus polishes a substrate by moving the substrate and a polishing pad relative to each other. The apparatus includes: an elastic modulus measuring device configured to measure an elastic modulus of the polishing pad, and a polishing condition adjustor configured to adjust polishing conditions of the substrate based on a measured value of the elastic modulus. The polishing conditions include pressure of a retaining ring, arranged around the substrate, exerted on the polishing pad and a temperature of the polishing pad.
Claims11
A method for adjusting a polishing condition, said method comprising:
- providing a polishing pad to polish a substrate, a top ring to hold the substrate, and a temperature adjusting mechanism to control a temperature of the polishing pad;
- measuring an elastic modulus of the polishing pad;
- and
- adjusting the temperature of the polishing pad based on a relationship between a measured value of the elastic modulus of the polishing pad and a size of surface of the substrate.
1 more element
Dependencies are inferred from the claim text.