Ingot and methods for ingot grinding
AssigneeMemc Singapore Pte. Ltd. (Uen200614794D)
InventorsJames A. Hicks, Nicholas R. Mercurio
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Abstract
A method of grinding an ingot for use in manufacturing a semiconductor or solar wafer is disclosed. The method includes providing an ingot including four flat sides and four rounded corner portions, each corner portion extending between an adjacent pair of the flat sides, and grinding a plurality of planar facets on each corner portion, each planar facet of the corner portion joined to an adjacent facet at a juncture and oriented such that each corner portion has a substantially arcuate shape. A wafer and ingot are also disclosed.
Claims20
A method of grinding an ingot for use in manufacturing semiconductor or solar wafers, the method comprising:
- providing an ingot including four flat sides and four corner portions, each corner portion extending between an adjacent pair of the flat sides;
- and
- grinding a plurality of planar facets on each corner portion, each planar facet of the corner portion joined to an adjacent facet at a juncture and oriented such that each corner portion has a substantially arcuate shape.
An ingot of semiconductor or solar material, the ingot comprising:
- four flat sides;
- and
- a corner portion extending between each adjacent pair of the flat sides, each corner portion including a plurality of planar facets, each planar facet of the corner portion joined to an adjacent facet at a juncture and oriented such that each corner portion has a substantially arcuate shape.
Dependencies are inferred from the claim text.