Microclosures and related methods for skin treatment
AssigneeCytrellis Biosystems, Inc.
InventorsDouglas Levinson, David Stone, Alec Ginggen
Life of this patent
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Abstract
The present invention relates to microclosures and methods for treating microwounds in the skin (e.g., after incising or excising tissue portions from a subject). Exemplary microclosures include a material having at least one dimension of from about 10 um to about 1 mm after application to a microwound. The microclosure maintains a first compressive force when applied to the microwound.
Claims47
A microclosure comprising a material having at least one dimension of from about 10 μm to about 1 mm after application to a microwound and having no dimension larger than 5 mm, wherein said microclosure maintains a first compressive force when applied to said microwound.
A method of treating skin comprising:
- (a) forming a plurality of microwounds, each having an areal dimension that is less than about 1 mm2 in the region of said skin and/or a volumetric dimension that is less than about 3 mm3 in the region of said skin;
- and
- (b) applying a plurality of microclosures to said plurality of microwounds, wherein said microclosure comprises a material having at least one dimension of from about 10 μm to about 1 mm after application,
- wherein said microclosure maintains a first compressive force, thereby treating said skin.
Dependencies are inferred from the claim text.