Electronic component mounting system, electronic component mounting method, and electronic component mounting machine

An electronic component mounting system for mounting a light-emitting element as an electronic component on a board by soldering, said electronic component mounting system comprising:

• a solder paste supply unit which places solder paste on a pair of lands formed on a top surface of the board;
• an adhesive applying unit which places adhesive for fixing of the light-emitting element to the board, on the board between the lands;
• an emission portion detecting unit which detects a positional deviation of an emission portion formed in a top surface of the light-emitting element;
• a light-emitting element position detecting unit which detects a position of the light-emitting element based on an image of a back surface of the light-emitting element which is obtained in a state in which the top surface of the light-emitting element is absorbed and held by a component holding unit of an electronic component mounting machine;
• a light-emitting element positioning unit which positions the light-emitting element with respect to the board by shifting the light-emitting element by its positional deviation by moving the component holding unit relative to the board using the positional deviation detected by the emission portion detecting unit and the position of the light-emitting element detected by the light-emitting element position detecting unit, to place the emission portion at a prescribed position on the board;
• a light-emitting element mounting unit which lowers the component holding unit toward the board such that terminals of the light-emitting element contact the solder paste formed on the respective lands and such that a main body of the light-emitting element contacts the adhesive formed on the board;
• an adhesive cuing unit which cures the adhesive and which fixes the light-emitting element to the board;
• and
• a reflow unit which melts solder in the solder paste in a state in which the light-emitting element is fixed to the board by the cured adhesive and which connects the terminals of the light-emitting elements to the respective lands of the board electrically and mechanically.