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US 2016/0081234 A1Published application
Package structure
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsChih-Hsien Chiu, Hsin-Lung Chung, Chia-Yang Chen, Chao-Ya Yang, Yude Chu, Chih-Ming Cheng
Life of this patent
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Abstract
A package structure is provided, including an electronic element with a low frequency, a shielding member connected to the electrosnic element, and an encapsulant covering the electronic element and the shielding member, such that the electronic element is shielded from erroneous signals.
Claims12
A package structure, comprising:
- at least one electronic component with a low frequency;
- at least one shielding member coupled onto the at least one electronic component;
- and
- an encapsulant encapsulating the electronic component and the shielding member.
1 more element
Dependencies are inferred from the claim text.