Heat dissipation structure for mobile device
AssigneeAsia Vital Components Co., Ltd.
InventorKuei-Feng Chiang
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Abstract
A heat dissipation structure for mobile device includes an element holding member internally defining a first receiving space, in which a plurality of electronic elements of a mobile device is mounted; and a heat dissipation layer formed on at least one side of each of the electronic elements. The heat dissipation layer is formed on one side of each of the electronic elements through a micro arc oxidation (MAO) process, a plasma electrolytic oxidation (PEO) process, an anodic spark deposition (ASD) process, or an anodic oxidation by spark deposition (ANOF) process. Therefore, heat produced by the electronic elements in the mobile device can be quickly removed away from the electronic elements via the heat dissipation layer.
Claims8
A heat dissipation structure for mobile device, comprising:
- an element holding member internally defining a first receiving space, in which a plurality of electronic elements of a mobile device is mounted;
- and
- a heat dissipation layer being formed on at least one side of each of the electronic elements through a process selected from the group consisting of a micro arc oxidation (MAO) process, a plasma electrolytic oxidation (PEO) process, an anodic spark deposition (ASD) process, and an anodic oxidation by spark deposition (ANOF) process.
Dependencies are inferred from the claim text.