Arrangement and method for cooling liquid-cooled electronics

An arrangement for cooling liquid-cooled electronics, the arrangement comprising:

• a pipe system, said pipe system comprising:
• receiving and exit coolant flow pipes for connecting the arrangement to a liquid-cooling system of said liquid-cooled electronics;
• inlet and outlet coolant flow pipes for connecting the arrangement to a heat exchanger arrangement;
• and
• an expansion tank connected to the coolant flow pipes;
• a coolant level transmitter arranged to detect the amount of the coolant in the expansion tank;
• a temperature measure arrangement arranged for measuring temperature of the coolant in the arrangement;
• and
• a leakage control system, the leakage control system comprising a calculator for calculating a temperature corrected reference value for the amount of the coolant in the expansion tank and for calculating a temperature corrected coolant volume by using said temperature corrected reference value.

A method for cooling liquid-cooled electronics, the method comprising the steps of:

• receiving coolant flow from the liquid-cooling system of said liquid-cooled electronics in a pipe system;
• feeding coolant flow to a heat exchanger arrangement;
• receiving cooled coolant flow from the heat exchanger arrangement to the pipe system;
• and
• feeding cooled coolant flow back from the pipe system to the liquid-cooling system of said liquid-cooled electronics,
• wherein said pipe system further comprises an expansion tank containing said coolant, whereby the method further comprises the steps of:
• detecting the amount of the coolant in the expansion tank;
• measuring a temperature of the coolant in the arrangement;
• and
• compensating a result by calculating coolant thermal expansion in the arrangement based on said temperature measurement.