Back to results
US 2016/0081199 A1Published application
Printed circuit board (pcb) and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJung Youn KIM
Life of this patent
Estimating the term…
Abstract
A manufacturing method of a printed circuit board (PCB), including: forming a conductive metal layer on a substrate having conductive pads exposed on one surface of the substrate; melting the conductive metal layer in a heat treatment; and forming solder bumps by concentrating portions of the melted conductive metal layer on the conductive pads, respectively.
Claims14
A manufacturing method of a printed circuit board (PCB), comprising:
- forming a conductive metal layer on a substrate having conductive pads exposed on one surface of the substrate;
- melting the conductive metal layer in a heat treatment;
- and
- forming solder bumps by concentrating portions of the melted conductive metal layer on the conductive pads, respectively.
1 more element
A printed circuit board (PCB) comprising:
- a substrate having conductive pads exposed on one surface of the substrate;
- and
- solder bumps formed on the conductive pads, respectively,
- wherein each of the solder bumps has a curved upper surface, and an interval between the solder bumps is 100 micrometers (μm) or less.
1 more element
Dependencies are inferred from the claim text.