Welded High-Density Low-Profile Interconnect System

The apparatus defined in claim a further comprising:

• an electronic device:
• housing in which the first and second printed circuits are located;
• and
• a structure in the electronic device housing, wherein the first and second printed circuits and the array of laser welds have shapes that accommodates the structure.

Apparatus, comprising:

• a first printed circuit having a plurality of first contacts;
• a second printed circuit having a plurality of second contacts;
• and
• a plurality of laser welds each of which couples a respective one of the first contacts to a respective one of the second contacts.

Apparatus, comprising:

• a first flexible printed circuit having metal traces forming first contact pads;
• a second flexible printed circuit having metal traces forming second contact pads;
• and
• welds that respectively join each of the first contact pads to a corresponding one of the second contact pads.