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US 2016/0081192 A1Published application
Strain isolation structures for stretchable electronics
AssigneeMC10, Inc.
InventorYung-Yu Hsu
Life of this patent
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Abstract
Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.
Claims2
An apparatus comprising:
- a device component;
- at least one conductive stretchable and/or flexible interconnect in electrical communication with the device component, the at least one conductive stretchable and/or flexible interconnect forming the electrical communication with the device component at a junction region;
- a buffer structure;
- and
- an encapsulant encapsulating at least the device component and the junction region, wherein:
- the buffer structure overlaps with at least a portion of the junction region;
- and
- the buffer structure has a higher value of Young's modulus than the encapsulant.
5 more elements
2-44. (canceled)
Dependencies are inferred from the claim text.