Printed circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJee-Soo MOK, Yong-Ho BAEK, Young-Gwan KO
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Abstract
A printed circuit board and a manufacturing method thereof are disclosed. The printed circuit board in accordance with an aspect of the present invention includes: a base board having a pad formed on one surface thereof; a copper clad laminate laminated on the one surface of the base board and having a cavity formed therein such that the pad is placed within the cavity; and an insulating adhesive layer interposed between the base board and the copper clad laminate in such a way that the pad is exposed
Claims8
A printed circuit board comprising:
- a base board having a pad formed on one surface thereof;
- a copper clad laminate laminated on the one surface of the base board and having a cavity formed therein such that the pad is placed within the cavity;
- and
- an insulating adhesive layer interposed between the base board and the copper clad laminate in such a way that the pad is exposed.
A method of manufacturing a printed circuit board, comprising:
- providing a base board having a pad formed on one surface thereof;
- laminating an insulating adhesive layer on the one surface of the base board;
- and
- laminating a copper clad laminate having a cavity formed therein on the insulating adhesive layer in such a way that the pad is placed within the cavity.
Dependencies are inferred from the claim text.