Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device

A conductive film formed using a composition, wherein the composition comprises:

• at least one of a metal salt (A1) and a metal particle (A2) as component (A) that serves as a metal source of the conductive film, wherein the metal salt (A1) and the metal particle (A2) contain one or more metals selected from the group consisting of Ni, Pd, Pt, Cu, Ag, and Au;
• and
• a metalloxane compound (B) having at least one metal atom selected from the group consisting of Ti, Zr, Sn, Si, and Al in its main chain.

A plating film produced by plating a conductive film, wherein the conductive film is formed using a composition, comprising:

• at least one of a metal salt (A1) and a metal particle (A2) as component (A) that serves as a metal source of the conductive film, wherein the metal salt (A1) and the metal particle (A2) contain one or more metals selected from the group consisting of Ni, Pd, Pt, Cu, Ag, and Au;
• and
• a metalloxane compound (B) having at least one metal atom selected from the group consisting of Ti, Zr, Sn, Si, and Al in its main chain.

An electronic device comprising a wiring board including a plating film, wherein the plating film is produced by plating a conductive film, wherein the conductive film is formed using a composition comprising:

• at least one of a metal salt (A1) and a metal particle (A2) as component (A) that serves as a metal source of the conductive film, wherein the metal salt (A1) and the metal particle (A2) contain one or more metals selected from the group consisting of Ni, Pd, Pt, Cu, Ag, and Au;
• and
• a metalloxane compound (B) having at least one metal atom selected from the group consisting of Ti, Zr, Sn, Si, and Al in its main chain.