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US 2016/0081188 A1Published application
Inorganic filler and epoxy resin composition including the same
AssigneeLG Innotek Co., Ltd.
InventorsSanga JU, Jina GU, Se Woong NA, Sung Jin YUN
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Abstract
An inorganic filler includes surface-modified boron nitride having a surface on which a polycyclic aromatic hydrocarbon having a functional group is provided.
Claims20
An inorganic filler comprising:
- surface-modified boron nitride;
- and
- a polycyclic aromatic hydrocarbon having a functional group formed on a surface of the boron nitride.
An epoxy resin composition comprising:
- an epoxy compound;
- and
- an inorganic filler including surface-modified boron nitride having a surface on which a polycyclic aromatic hydrocarbon having a functional group is provided.
A printed circuit board comprising:
- a substrate;
- an insulating layer formed on the substrate;
- and
- a circuit pattern formed on the insulating layer,
- wherein the insulating layer includes an epoxy resin composition, which includes an epoxy compound, and an inorganic filler including surface-modified boron nitride having a surface on which a polycyclic aromatic hydrocarbon having a functional group is provided.
2 more elements
Dependencies are inferred from the claim text.