Substrate structure and method of fabricating the same

A method of fabricating a substrate structure, comprising:

• forming on a first carrier a first wiring layer having opposing first and second surfaces, with the first surface of the first wiring layer coupled to the first carrier;
• forming on the second surface of the first wiring layer a dielectric layer that has at least one hole exposing a portion of the first wiring layer;
• forming a second wiring layer on the dielectric layer, and forming in the at least one hole, from which the portion of the first wiring layer is exposed, at least a conductive via that is electrically connected to the second wiring layer and the first wiring layer;
• forming on the dielectric layer and the second wiring layer an insulating protection layer that has at least one opening that exposes a portion of the second wiring layer;
• forming a second carrier on the insulating protection layer;
• and
• removing the first carrier.