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US 2016/0081185 A1Published application
Wired circuit board and producing method thereof
AssigneeNitto Denko Corporation
InventorsJun ISHII, Saori KANAZAKI
Life of this patent
Estimating the term…
Abstract
A wired circuit board includes a wire, and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired circuit board. The terminal includes, at the one surface thereof in the thickness direction, a projecting portion projecting toward one side thereof in the thickness direction, and a covering layer covering one end portion of the projecting portion in the thickness direction.
Claims2
A wired circuit board, comprising:
- a wire;
- and
- a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired circuit board,
- wherein the terminal includes, at the one surface thereof in the thickness direction, a projecting portion projecting toward one side thereof in the thickness direction, and a covering layer covering one end portion of the projecting portion in the thickness direction,
- wherein the wire and the terminal are provided integrally in a conductive pattern,
- the wired circuit board further comprising:
- an insulating base layer formed on the one side of the conductive pattern in the thickness direction;
- and
- a metal supporting board formed on the one side of the insulating base layer in the thickness direction,
- wherein the insulating base layer is formed with a base opening exposing the one surface of the terminal in the thickness direction,
- wherein the metal supporting board is formed with a support opening exposing the one surface of the terminal in the thickness direction, and
- wherein the covering layer is formed of the same material as that of the metal supporting board.
9 more elements
-14. (canceled)
Dependencies are inferred from the claim text.