Liquid Cooled Metal Core Printed Circuit Board
OwnerNicholas Michael D'Onofrioinventor
Life of this patent
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Abstract
The present disclosure further contemplates a system and method that cools metal core printed circuit boards by circulating a liquid coolant so that it contacts the base metal of the metal core printed circuit board. In one example the present disclosure contemplates a direct liquid cooled MCPCB system that may include a liquid cavity creating component coupled to the base plate of a MCPCB allowing a liquid coolant to come into contact with the base plate of the MCPCB for cooling of the MCPCB. The direct liquid cooled MCPCB system may minimize thermal bottlenecks between the electrical components and the cooling fluid while reducing the number of components required in previous liquid cooled electronics systems.
Claims20
A direct liquid cooled metal core printed circuit board system comprising:
- a liquid cavity creating component having an interior surface and an exterior surface, wherein the liquid cavity creating component may be coupled to a base plate of a metal core printed circuit board such that a cavity forms between the interior surface of the liquid cavity creating component and the base plate of the metal core print circuit board;
- and
- a first fastening mechanism, wherein the first fastening mechanism may couple the liquid cavity creating component to the base plate of a metal core printed circuit board.
A method for direct cooling of a metal core printed circuit board, the method comprising:
- coupling a liquid cavity creating component to a metal core printed circuit board;
- and
- introducing a liquid coolant into a liquid cavity formed between the liquid cavity creating component and a base plate of the metal core printed circuit board, allowing the liquid coolant to directly contact the base plate of the metal core printed circuit board.
Dependencies are inferred from the claim text.