Surface acoustic wave device
AssigneeMurata Manufacturing Co., Ltd.
InventorsTaku KIKUCHI, Masahiro FUKUSHIMA
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Abstract
A surface acoustic wave device includes a piezoelectric substrate, a dielectric film, IDT electrodes, and a resin member. The surface acoustic wave device includes a resin contact region where the piezoelectric substrate and the resin member are in direct contact with each other. The resin contact region has a shape surrounding the IDT electrodes. Because the resin member exhibits a strong adhesion force with respect to the piezoelectric substrate, peeling-off between the piezoelectric substrate and the resin member is significantly reduced or prevented, and an airtight condition is maintained in the interior of the surface acoustic wave device.
Claims19
A surface acoustic wave device comprising:
- a piezoelectric substrate;
- a dielectric film located on a principal surface of the piezoelectric substrate;
- IDT electrodes located on the piezoelectric substrate with a dielectric film interposed therebetween;
- and
- a resin member located on the piezoelectric substrate at a position spaced away from the IDT electrodes and covering the IDT electrodes;
- wherein
- the surface acoustic wave device includes a resin contact region defined by an area where the piezoelectric substrate and the resin member are in direct contact with each other;
- and
- the resin contact region surrounds the IDT electrodes.
Dependencies are inferred from the claim text.