US 2016/0079950 A1Published application

Via system of printed circuit board and method of making same

AssigneeScienBiziP Consulting (Shen Zhen) Co., Ltd.

InventorsMING-HSIEN CHENG, PO-CHUAN HSIEH, YING-TSO LAI, CHIEN-HSUN CHEN

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Abstract

A printed circuit board (PCB) includes a top outer layer, a bottom outer layer, a signal transmission layer, an inner signal transmission layer, and a via system defined in the PCB. The via system includes two pairs of vias configured to transmit signals from a transmitter to a receiver. A signal transmission pathway is defined in the top outer layer, the signal transmission layer, and the inner signal transmission layer. Signals are sent from the transmitter to a first pair of vias, the signals are transmitted from the first pair of vias to a second pair of vias, and the signals are sent from the second pair of vias to the receiver. The two pairs of vias and the signal transmission pathway provide impedance matching to the signals.

Claims20

Dependent claims

A printed circuit board (PCB) comprising:

a top outer layer;
a bottom outer layer;
a signal transmission layer;
an inner signal transmission layer;
and
a via system defined in the PCB;
wherein the via system is configured for routing a signal transmission line and comprises a first pair of vias and a second pair of vias, the first pair of vias and the second pair of vias each comprising a first via and a second via;
the first via and the second via both extend through the top outer layer, the signal transmission layer, the inner signal transmission layer, and the bottom outer layer;
the second via is located closer to a side edge of the PCB than the first via;
a first signal transmission pathway of the via system is defined in the top outer layer and connects a transmitter to the second via of a first pair of vias;
a second signal transmission pathway of the via system is defined in the inner signal transmission layer and connects the second via of the first pair of vias to the first via of the first pair of vias;
a third signal transmission pathway of the via system is defined in the signal transmission layer and connects the first via of the first pair of vias to the first via of the second pair of vias;
a fourth signal transmission pathway of the via system is defined in the inner signal transmission layer and connects the first via of the second pair of vias to the second via of the second pair of vias;
a fifth signal transmission pathway of the via system is defined in the top outer layer and connects the second via of the second pair of vias to a receiver;
a signal is sent from the transmitter to the second via of the first pair of vias through the first signal transmission pathway;
the signal is transmitted from the second via of the first pair of vias to the first via of the first pair of vias through the second signal transmission pathway;
the signal is transmitted from the first via of the first pair of vias to the first via of the second pair of vias through the third signal transmission pathway;
the signal is transmitted from the first via of the second pair of vias to the second via of the second pair of vias through the fourth signal transmission pathway;
and the signal is transmitted from the second via of the second pair of vias to the receiver through the fifth signal transmission pathway.

16 more elements

A method for designing a via system of a printed circuit board (PCB), the method comprising;

determining a signal input layer, a signal transmission layer, and an inner signal transmission layer of the PCB;
designing a characteristic impedance of all vias of the via system;
determining a length of a first via stub, a second via stub, and a third via stub;
calculating a first length, the first length being a length of the first via between the first via stub and the second via stub;
and
calculating a second length, the second length being a length of a signal transmission pathway defined in the inner signal transmission layer and located between the first via and the second via;
wherein the PCB comprises two pairs of vias, each pair of vias comprising a corresponding first via and a corresponding second via;
the signal input layer is located in a top outer layer of the PCB, and the signal transmission layer is located between the signal input layer and the inner signal transmission layer;
the first via stub and the second via stub are located at opposite end portions of the first via, the first via stub opening through the top outer layer of the PCB, and the second via stub opening through a bottom outer layer of the PCB;
the third via stub is located at an end portion of the second via and opens through the bottom outer layer of the PCB.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/485,312Filed 12 Sep 2014
Published: 17 Mar 2016
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

G06F 30/394
Circuit design at the physical level: routing
H05K 1/0251
Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance: related to vias or transitions between vias and transmission lines
H05K 1/0245
High frequency adaptations: lay-out of balanced signal pairs, e.g. differential lines or twisted lines
H05K 1/0298
Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295: multilayer circuits