High speed communication jack
AssigneeSentinel Connector System Inc.
InventorBrett ROBINSON
Life of this patent
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Abstract
A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, a shielding case surrounding the housing, a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.
Claims20
A high speed communication jack including:
- a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug;
- a shielding case surrounding the housing;
- a rigid circuit board in the housing having
- a substrate,
- a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing,
- a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias;
- a first shielding layer on a first side of the middle layer in the substrate;
- a second shielding layer on a second side of the middle layer in the substrate;
- and
- a third shielding layer adjacent to the second shielding layer.
A high speed communication jack comprising a standard RJ45 housing having a port for accepting a plug, the port including a plurality of pins connected to a corresponding signal line in the plug, the jack comprising:
- a shielding case surrounding the housing
- a rigid circuit board on the lower portion of the housing having
- a substrate,
- a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing,
- a plurality of traces on a middle layer of the substrate, with each trace extending from a corresponding one of the plurality of vias, and
- a first shielding layer on a first side of the middle layer in the substrate;
- a second shielding layer on a second side of the middle layer in the substrate;
- and
- a third shielding layer adjacent to the second shielding layer.
A method of forming a high speed communication jack, the method including:
- forming a first grounding layer,
- forming a second layer of a dielectric material on a side of the first layer,
- forming a third layer on a side of the second layer opposite the first layer and having a grounding plane made from a conductive material;
- forming a fourth layer on a side of the third layer opposite the second layer and made of a dielectric material;
- forming a fifth layer on a side of the fourth layer opposite the third layer and having a grounding plane made of a conductive material;
- forming a sixth layer formed on a side of the fifth layer opposite the fourth layer and made of a dielectric material;
- forming a seventh layer formed on a side of the sixth layer opposite the fifth layer and having a grounding plane made of a conductive material;
- and
- forming vias through the first layer, second layer, third layer, fourth layer, fifth layer, sixth layer and seventh layer,
- wherein the third layer includes a plurality of traces extending from each via.
A high speed communication jack including:
- a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug;
- a shielding case surrounding the housing
- a multilayer rigid circuit board in the housing having
- a first grounding layer,
- a second layer of a dielectric material on a side of the first layer,
- a third layer on a side of the second layer opposite the first layer and having a grounding plane made from a conductive material;
- a fourth layer on a side of the third layer opposite the second layer and made of a dielectric material;
- a fifth layer on a side of the fourth layer opposite the third layer and having a grounding plane made of a conductive material;
- a sixth layer formed on a side of the fifth layer opposite the fourth layer and made of a dielectric material;
- a seventh layer formed on a side of the sixth layer opposite the fifth layer and having a grounding plane made of a conductive material;
- and
- a plurality of vias extending through the first, second, third, fourth, fifth sixth and seventh layers, with each via being configured to accommodate a pin on the housing,
- wherein the third layer includes a plurality of traces extending from each via.
Dependencies are inferred from the claim text.