Horn-like extension for integrated antenna
AssigneeOmniradar BV
InventorsPaulus Thomas Maria VAN ZEIJL, Hans BROUWER, Jaques Leopold Catharina ROMPEN, Timofey Grigorievich SAVELYEV
Life of this patent
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Abstract
A radiofrequency assembly includes a module with an antenna assembly formed in a semiconductor integrated circuit. The semiconductor integrated circuit can carry out at least one of the following functions: transmitting an electromagnetic signal, and receiving an electromagnetic signal. The radiofrequency assembly further includes a horn-like structure with a base portion adapted to fit on the module. The horn-like structure has an extending horn-shaped portion an input opening that encloses the antenna assembly when the horn-like structure is fitted on the module.
Claims14
A device having the characteristics that an integrated transmitter-receiver with one or multiple antennas is combined in an integrated circuit or in the housing in combination with a horn-like structure which gives direction to the antenna radiation pattern.
A device according to any one of the preceding claims wherein the horn-like structure is made of metal.
A device according to any one of the preceding claims wherein the horn-like structure is made of plastic and is covered with of a metal or metal-like structure.
A device according to any one of the preceding claims wherein additional flanges and/or reinforcing ribs and/or mounting holes have been added to the horn-like structure for an improvement of the stiffness and robustness, and for ease of fixation.
A device according to any one of the preceding claims wherein the overall structure is used in a radar system.
A device according to any one of the preceding claims wherein at least two receivers with antennas are used in such a way that the angle of reception of a reflection can be determined.
A device according to any one of the preceding claims wherein the metallic-coating layer is provided on the outside of the horn-like structure.
A device according to any one of the preceding claims wherein the horn-like structure is filled with a material having a dielectric constant, and has a lens-like shape.
A device according to any one of the preceding claims, wherein a matrix of integrated circuits is mounted on a PCB in combination with a matrix of horn-like structures, which is affixed on top of the integrated circuits.
A device according to any one of the preceding claims wherein the semiconductor material is silicon, silicon-germanium, gallium-arsenide or gallium-nitride.
A device according to any one of the preceding claims with the features of an integrated transmitter-receiver intended for communication or radar applications, wherein one or more antennas are integrated on the semiconductor material, in which one or more seal rings are used, wherein in the first seal ring more or less all the doping layers and more or less all the metal layers are used, and a second sealing ring, wherein more or less all the doping layers and more or less all of the metal layers in a part of the integrated circuit are used, and in and another part of the integrated circuit conductive (semiconductor and/or metal) layers are used, and in which one or more antennas have been formed between the first and second seal rings, and wherein the antennas are connected to the electronic circuitry within the first seal ring by using of a hole in the first sealing ring consisting of (preferably) a hole in a single metal layer (and the corresponding via-layer, or layers) by means of a metal connecting track, wherein overall the desired antenna radiation pattern is achieved, while also the desired reliability and yield of standard semiconductor processing remains possible.
A device according to any one of the preceding claims, wherein padding is applied on the integrated circuit.
A device according to any one of the preceding claims wherein the antenna is connected to a bond pad so that a high-frequency signal can be measured or injected in order to be able to test the whole.
A device according to any one of the preceding claims wherein additional measurement circuits are added to measure DC voltage/current and/or high-frequency voltage/current/power, frequency and/or reflection and/or matching on one or more antenna ports.
Dependencies are inferred from the claim text.