Optoelectronic Component
AssigneeOSRAM OLED GmbH
InventorSimon Schicktanz
Life of this patent
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Abstract
An optoelectronic component includes a substrate, a first electrode on the substrate, a radiation-emitting or radiation-absorbing layer sequence on the first electrode, a second electrode on the layer sequence, an encapsulation layer on the second electrode, and a covering layer on the encapsulation layer. The covering layer has a first main surface and second main surface. At least one intended rupture surface is provided between the first and the second main surface of the covering layer.
Claims21
1-15. (canceled)
An optoelectronic component comprising:
- a substrate;
- a first electrode on the substrate;
- a radiation-emitting or radiation-absorbing layer sequence on the first electrode,
- a second electrode on the layer sequence;
- an encapsulation layer on the second electrode;
- a covering layer on the encapsulation layer and having a first and a second main surface;
- and
- a predetermined breaking surface between the first and the second main surface of the covering layer.
An optoelectronic component comprising:
- a substrate;
- a first electrode on the substrate;
- a radiation-emitting or radiation-absorbing layer sequence on the first electrode;
- a second electrode on the layer sequence;
- an encapsulation layer arranged on the second electrode;
- and
- a covering layer arranged on the encapsulation layer and having a first and a second main surface;
- and
- a predetermined breaking surface between the first and the second main surface of the covering layer, wherein the predetermined breaking surface is configured so that, in the event of a mechanical loading of the optoelectronic component, a cohesion failure takes place at the at least one predetermined breaking surface.
An optoelectronic component comprising:
- a substrate;
- a first electrode on the substrate;
- a radiation-emitting or radiation-absorbing layer sequence on the first electrode;
- a second electrode on the layer sequence;
- an encapsulation layer on the second electrode;
- a covering layer on the encapsulation layer, the cover layer having a first and a second main surface;
- and
- a predetermined breaking surface between the first and the second main surface of the covering layer;
- wherein the covering layer comprises an adhesive layer and a cover substrate layer on the adhesive layer;
- wherein an intermediate layer is arranged between the adhesive layer and the cover substrate layer;
- and
- wherein the optoelectronic component is configured so that, in case of a mechanical loading of the optoelectronic component, one of the following events happens:
- a cohesion failure takes place in the intermediate layer, or an adhesion failure takes place at an interface between the intermediate layer and the adhesive layer, or an adhesion failure takes place at an interface between the intermediate layer and the cover substrate layer, or combinations thereof.
Dependencies are inferred from the claim text.