Semiconductor device and method of manufacturing the same

Abstract

A semiconductor device includes a substrate, a magnetic shield plate, a semiconductor element, a sealing layer, and a magnetic shield film. The magnetic shield plate includes a plate portion disposed along the substrate, inclined portions extending in obliquely upward directions from opposite edges of the plate portion, and arcuate portions disposed at tip ends of the inclined portions. The semiconductor element is mounted on the plate portion. The sealing layer seals the semiconductor element and the plate portion and the inclined portions of the magnetic shield plate. At least a part of each of the arcuate portions is exposed on a surface of the sealing layer. The magnetic shield film covers an upper surface of the sealing layer and is in contact with each of the arcuate portions.

Dependencies are inferred from the claim text.