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AssigneeNGK Insulators, Ltd.
InventorsTomoyoshi Tai, Yuji Hori
Estimating the term…
A piezoelectric substrate 22 and a support substrate 27 are prepared (a), these are joined to each other with an adhesive layer 26 therebetween to form a composite substrate 20 (b), and a surface of the piezoelectric substrate 22 is polished to thin the piezoelectric substrate 22 (c). Then, grooves 28 dividing the piezoelectric substrate 22 into parts having a size for a piezoelectric device are formed by half-dicing the composite substrate 20 (d). By forming the grooves 28, the adhesive layer 26 is exposed in the grooves 28. By immersing the composite substrate in solvent, the adhesive layer 26 is removed by the solvent, and the piezoelectric substrate 22 is detached from the support substrate (e), (f), and a piezoelectric device 10 is obtained using the detached piezoelectric substrate 12 (g).
A method for manufacturing a piezoelectric device, comprising the steps of:
A piezoelectric self-supporting substrate having a thickness of 0.2 ∝m or more and 5 ∝m or less, a length of 0.1 mm or more, a width of 0.1 mm or more, and a TTV (Total Thickness Variation) of 0.1 ∝m or less.
Dependencies are inferred from the claim text.