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AssigneeSagem Defense Securite
InventorPhilippe ONFROY
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A method for controlling a piezoelectric device comprising a piezoelectric element (1) attached to a substrate (2), with the substrate (2) and the piezoelectric element (1) being made of materials having different coefficients of thermal expansion, with the method comprising the step of subjecting the piezoelectric element (1) to a predetermined electric voltage in order to cause a set deformation of the piezoelectric element (1). The determined electric voltage comprises a compensation portion determined according to ambient temperature to cancel a stress generated on the vibrating element (1) due to a differential thermal expansion between the vibrating element (1) and the substrate (2). A piezoelectric device for implementing said method.
A method for controlling a piezoelectric device comprising a piezoelectric element (1) fixed on a substrate (2), with the substrate (2) and the piezoelectric element (1) being made of materials having different coefficients of thermal expansion, with the method comprising the step of subjecting the piezoelectric element (1) to a determined electric voltage (U) to cause a set deformation of the piezoelectric element (1), characterized in that the determined electric voltage (u) comprises a compensation portion (U′) determined according to ambient temperature (Θ) to cancel a stress generated on the vibrating element (1) due to a differential thermal expansion between the vibrating element (1) and the substrate (2).
A piezoelectric device comprising a piezoelectric element (1) fixed on a substrate (2), with the substrate (2) and the piezoelectric element (1) being made of materials having different coefficients of thermal expansion, with the device comprising a control unit (4) which is connected to an energizing circuit (4) of the piezoelectric element (1) and which is so arranged as to implement the method according to any one of the preceding claims.
Dependencies are inferred from the claim text.