Light emitting device and lighting apparatus having the same
AssigneeLG Innotek Co., Ltd.
InventorsSong Eun LEE, Gyu Hyeong BAK, Bong Kul MIN
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Abstract
Disclosed are a light emitting device and a lighting apparatus having the same. The light emitting device includes a plurality of lead frames, a first body having non-transmissive resin material on top surfaces of the lead frames, a second body having transmittance resin material on a top surface of the first body, a light emitting chip on at least one of the lead frames exposed in the first opening of the second body, and a first transmissive layer disposed in the first opening of the second body. The first body and the second body is disposed around the light emitting chip.
Claims20
A light emitting device comprising:
- a plurality of lead frames;
- a light emitting chip on at least one of the plurality lead frames;
- a first body disposed on the plurality of lead frames;
- a second body disposed on the first body;
- a gap part between the plurality of lead frames;
- and
- a first transmissive layer disposed on the light emitting chip,
- wherein the light emitting chip is electrically connected to the plurality of lead frames,
- wherein the first body has an open region,
- wherein the second body has a first opening overlapped with the open region of the first body,
- wherein the light emitting chip is disposed in the first opening of the second body,
- wherein a top surfaces of the plurality of lead frames are exposed on the first opening of the second body,
- wherein the first body includes a non-transmissive resin material,
- wherein the second body includes a transmissive resin material,
- wherein the first body and the second body are disposed around the light emitting chip,
- wherein the second body is overlapped with the second body around the light emitting chip in a vertical direction, and
- wherein a first region of the second body is disposed between the light emitting chip and the first body on the plurality of lead frames.
A light emitting device comprising:
- a plurality of lead frames having a first lead frame and a second lead frame;
- a light emitting chip on at least one of the first lead frame and the second lead frame;
- a first body disposed on the first lead frame and the second lead frame;
- a second body disposed on the first body;
- a gap part between the first lead frame and the second lead frame;
- and
- a first transmissive layer disposed on the light emitting chip,
- wherein the light emitting chip is electrically connected to the plurality of lead frames,
- wherein the first body has an open region,
- wherein the second body has a first opening in the open region of the first body,
- wherein the first opening of the second body has a width smaller than a width of the open region of the first body,
- wherein the light emitting chip is disposed in the first opening of the second body,
- wherein a top surfaces of the first lead frame and the second lead frame are exposed on the first opening of the second body,
- wherein the first body includes a non-transmissive resin material,
- wherein the second body includes a transmissive resin material,
- wherein the first body and the second body are disposed around the light emitting chip,
- wherein the second body is overlapped with the second body around the light emitting chip in a vertical direction,
- wherein a first region of the second body is disposed between the light emitting chip and the first body on the plurality of lead frames, and
- wherein the first transmissive layer is spaced apart from the first body on the top surfaces of the first lead frame and the second lead frame and contacts the second body.
Dependencies are inferred from the claim text.