Lead frame for mounting led elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
AssigneeDai Nippon Printing Co., Ltd.
InventorsKazunori ODA, Masaki YAZAKI
Life of this patent
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Abstract
A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.
Claims21
A lead frame for mounting LED elements, comprising:
- a frame body region;
- and
- a large number of package regions arranged in multiple rows and columns in the frame body region, the package regions each including a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad,
- wherein the die pad in one package region and the lead section in another package region adjacent to the package region of interest are connected to each other by an inclined reinforcement piece.
A lead frame for mounting LED elements, comprising:
- a frame body region;
- and
- a large number of package regions arranged in multiple rows and columns in the frame body region, the package regions each including a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad,
- wherein the lead section in at least one package region is connected to the lead section in another package region adjacent to the package region of interest, by a lead connecting portion;
- and
- wherein the lead section in one package region and the die pad in another package region adjacent to the package region of interest are connected to each other by an inclined reinforcement piece.
A lead frame for mounting semiconductor elements, comprising:
- a frame body region;
- and
- a large number of package regions arranged in multiple rows and columns in the frame body region, the package regions each including a die pad on which a semiconductor element is to be mounted and a lead section adjacent to the die pad,
- wherein the die pad in one package region and the lead section in another package region adjacent to the package region of interest are directly connected to each other by an inclined reinforcement piece.
A lead frame for mounting semiconductor elements, comprising:
- a frame body region;
- and
- a large number of package regions arranged in multiple rows and columns in the frame body region, the package regions each including a die pad on which a semiconductor element is to be mounted and a lead section adjacent to the die pad,
- wherein the lead section in at least one package region is connected to the lead section in another package region adjacent to the package region of interest, by a lead connecting portion;
- and
- wherein the lead section in one package region and the die pad in another package region adjacent to the package region of interest are directly connected to each other by an inclined reinforcement piece.
Dependencies are inferred from the claim text.