Semiconductor light emitting device and light emitting apparatus

A semiconductor light emitting device, comprising:

• a semiconductor substrate having a first face on a first side, a second face on a second side opposite to the first side, and a third face connecting the first face to the second face;
• a first light reflection film on the first face and at least a first portion of third face;
• and
• a laminated body disposed on the second side of the semiconductor substrate, the laminated body including a first semiconductor layer, a second semiconductor layer, and a light emitting layer between the first semiconductor layer and the second semiconductor layer.

A method, comprising:

• forming a laminated body on a first substrate, the laminated body including a first semiconductor layer, a second semiconductor layer, and a light emitting layer between the first and second semiconductor layers;
• bonding the laminated body to a second substrate having a first face on a first side, a second face on a second side opposite to the first side, the laminated body being on the second side of the second substrate;
• removing at least a portion of the first substrate;
• dicing the second substrate into a plurality of portions while the second substrate is supported on a dicing sheet, the dicing forming a third face on each of the plurality of portions of the second substrate, the third faces respectively connecting first and second faces of each of the plurality of portions of the second substrate;
• adhering a resin sheet to the laminated body after dicing the second substrate;
• and
• exposing the first face of the second substrate and then depositing a first light reflection film on the first face and at least a portion of at least one third face, wherein
• a spacing between adjacent third faces during the depositing of the first light reflection film is adjusted by applying force to the resin sheet in a plane parallel to the first face.