Light-emitting diode package structure

A light-emitting diode package structure, comprising:

• a package carrier;
• a plate-like light guiding component having no obliquely running side areas, disposed on the package carrier;
• a light emitting unit, being capable of emitting a light, disposed on a first portion of an upper surface of the light guiding component and at least exposing a second portion of the upper surface of the light guiding component;
• a wavelength-conversion layer, covering the light guide component and the light emitting unit, wherein the wavelength-conversion layer extracts a first portion of the light directly from the light emitting unit and a second portion of the light from the second portion of the upper surface of the light guiding component;
• and
• a package encapsulant, encapsulating the package carrier and the wavelength-conversion layer.

A light-emitting diode package structure, comprising:

• a package carrier;
• a plate-like light guiding unit having no obliquely running side areas, disposed on the package carrier;
• a reflecting layer, disposed between the light guiding unit and the package carrier;
• and
• a light emitting unit, being capable of emitting a light, disposed on a first portion of an upper surface of the light guiding unit and at least exposing a second portion of the upper surface of the light guiding unit;
• and
• a wavelength-conversion layer, covering the light guide unit, the reflecting layer and the light emitting unit, wherein the wavelength-conversion layer extracts a first portion of the light directly from the light emitting unit and a second portion of the light from the second portion of the upper surface of the light guiding unit.