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US 2016/0079493 A1Published application
Light emitting device and manufacturing method thereof
AssigneeKabushiki Kaisha Toshiba
InventorMie MATSUO
Life of this patent
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Abstract
A light emitting device includes a frame, a light emitting element provided above the frame and including a substrate, a light emitting layer provided above the substrate, a first reflective layer provided on a bottom surface of the substrate, a second reflective layer provided on a side surface of the substrate, and an electrode, and a bonding wire with one end electrically connected to the electrode and another end electrically connected to the frame.
Claims13
A light emitting device comprising:
- a frame;
- a light emitting element provided above the frame and including a substrate, a light emitting layer provided above the substrate, a first reflective layer provided on a bottom surface of the substrate, a second reflective layer provided on a side surface of the substrate, and an electrode;
- and
- a bonding wire with one end electrically connected to the electrode and another end electrically connected to the frame.
1 more element
A method of manufacturing a light emitting device comprising:
- bonding a base substrate, a plurality of light emitting layers and electrodes provided on an upper portion of the base substrate, to a dicing substrate that is to be diced from an upper side of the base substrate;
- separating the base substrate bonded to the dicing substrate into pieces;
- forming a first reflective layer on a bottom surface of each piece of the base substrate and a second reflective layer on a side surface of each piece of the base substrate;
- bonding one of the pieces having the first and second reflective layers to a top surface of a frame using an adhesive layer;
- and
- electrically connecting the electrode bonded to the one of the pieces having the first and second reflective layers with a bonding wire.
3 more elements
Dependencies are inferred from the claim text.