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US 2016/0079492 A1Published application
Light emitting apparatus and lighting apparatus
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsAtsuyoshi ISHIMORI, Toshifumi OGATA, Masumi ABE
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Abstract
Light emitting apparatus including: substrate; LED chips on substrate; sealing member sealing LED chips; buffer layer on substrate; and dam material on the top surface of buffer layer, for holding back sealing member, wherein the adhesive strength of buffer layer to substrate and the adhesive strength of dam material to buffer layer are higher than the adhesive strength of dam material to substrate.
Claims9
A light emitting apparatus comprising:
- a substrate;
- a light emitting element on the substrate;
- a sealing member sealing the light emitting element;
- a buffer layer on the substrate;
- and
- a dam material on a top surface of the buffer layer, for holding back the sealing member, wherein
- an adhesive strength of the buffer layer to the substrate and an adhesive strength of the dam material to the buffer layer are higher than an adhesive strength of the dam material to the substrate.
4 more elements
Dependencies are inferred from the claim text.