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US 2016/0079487 A1Published application
Semiconductor light-emitting device
AssigneeKabushiki Kaisha Toshiba
InventorToshihiro KUROKI
Life of this patent
Estimating the term…
Abstract
A semiconductor light-emitting device includes a package that includes a bottom surface and a first side section provided surround the bottom surface, a chip that includes a supporting substrate and a light-emitting section provided on the supporting substrate and is disposed on the bottom surface and spaced from the first side section, and a phosphor layer that is on the chip in a region above the bottom surface.
Claims20
A semiconductor light-emitting device, comprising:
- a resin package element that includes a first surface section including a first surface in a first plane and a first side section surrounding a perimeter of the first surface, the first side section extending in a first direction orthogonal to the first plane and having a second surface spaced from the first surface in the first direction;
- a chip that includes a supporting substrate and a light-emitting section on the supporting substrate, the chip being disposed on the first surface section within the perimeter of the first surface;
- and
- a phosphor layer above the chip in the first direction.
1 more element
A light emitting device, comprising:
- a package including:
- a base section including a first surface,
- a first side section surrounding a perimeter of the first surface by a first side section, and
- a second side section that forms side surfaces of the package;
- a chip disposed in the package on the first surface, within the perimeter, and including a supporting substrate and a light emitting section on the supporting substrate;
- a phosphor layer including a resin material containing a plurality of phosphors dispersed therein, the phosphor being excited by light from the light emitting section;
- and
- a transparent resin between the first side section and the chip.
5 more elements
A light emitting device, comprising:
- a light emitting element disposed on a substrate;
- a resin package including a first surface and first concave section surrounding a perimeter of the first surface, the first concave section extending in a first direction orthogonal to the first surface, the resin package element being reflective of light emitting by the light emitting element, the substrate being disposed on the first surface, and the light emitting element being within the perimeter of the first surface and not contacting the first concave section;
- phosphor layer including a phosphor excited by light emitted by the light emitting layer and being above the first surface in the first direction;
- and
- a transparent resin without phosphors being between the light emitting element and the first concave section in a second direction parallel to the first surface.
2 more elements
Dependencies are inferred from the claim text.