Semiconductor light emitting device package

A semiconductor light emitting device package comprising:

• a package body having first and second electrode structures;
• and
• a light emitting diode chip mounted on the second electrode structure of the package body,
• the light emitting diode chip including:
• a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, the second conductivity type semiconductor layer being electrically connected to the second electrode structure,
• a transparent electrode layer disposed on the first conductivity type semiconductor layer,
• an insulating layer disposed on at least a side surface of the light emitting structure, and
• aside electrode electrically connecting the transparent electrode layer and the first electrode structure to each other and disposed on a surface of the insulating layer.

A semiconductor light emitting device package, comprising:

• a package body having first and second electrode structures;
• a light emitting diode chip mounted on the package body and including a light emitting structure including first and second conductivity type semiconductor layers and an active layer interposed between the first and second conductivity type semiconductor layers;
• and
• a transparent electrode layer covering the first conductivity type semiconductor layer,
• wherein the first conductivity type semiconductor layer and the first electrode structure are electrically connected to each other via the transparent electrode layer and a side electrode formed on a side surface of the light emitting diode chip.