Semiconductor devices and related methods
OwnerArthur Fong-Yuen Pun, David B. Slater, JR.inventors
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Abstract
Semiconductor devices and related methods are disclosed. In one aspect, a semiconductor device includes a substrate and an active area disposed over the substrate. The active area includes at least one or more corner region having a non-orthogonal angled edge. A method of providing a semiconductor device is also provided. The method includes providing a substrate and fabricating an active area over the substrate. The active area includes at least one or more corner region with a non-orthogonal angled edge. LED chips and methods herein have a reduced sensitivity to corner cracking, fracturing, or chipping.
Claims27
A semiconductor device comprising:
- a substrate;
- and
- an active area disposed over the substrate, wherein the active area comprises at least one or more corner region having a non-orthogonal, angled edge.
A method of providing a semiconductor device, wherein the method comprises:
- providing a substrate;
- and
- fabricating an active area over the substrate, wherein the active area comprises at least one or more corner region having a non-orthogonal, angled edge.
A semiconductor device comprising:
- a substrate;
- and
- an active area disposed over the substrate, wherein the active area comprises an outer border having more than four linear side edges.
A semiconductor device comprising:
- a substrate comprising a plurality of lateral side edges defining at least one corner;
- and
- an active area disposed over the substrate, the active area comprising a plurality of outer edges and at least one corner region proximate to the corner of the substrate;
- wherein a first distance disposed between an outermost edge of the corner region of the mesa and the corner of the substrate is at least approximately three (3) times greater than a second distance disposed between one outer edge of the mesa and one lateral side edge of the substrate.
Dependencies are inferred from the claim text.