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US 2016/0079423 A1Published application
Enhanced dislocation stress transistor
AssigneeIntel Corporation
InventorsCory E. Weber, Mark Y. Liu, Anand Murthy, Hemant Deshpande, Daniel B. Aubertine
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Abstract
A device is provided. The device includes a transistor formed on a semiconductor substrate, the transistor having a conduction channel. The device includes at least one edge dislocation formed adjacent to the conduction channel on the semiconductor substrate. The device also includes at least one free surface introduced above the conduction channel and the at least one edge dislocation.
Claims13
A device comprising:
- a gate electrode on a gate dielectric, wherein the gate dielectric is on a silicon substrate;
- a first spacer adjacent to a first side of the gate electrode;
- a second spacer adjacent to a second side of the gate electrode;
- a channel region in the silicon substrate below the gate dielectric;
- a first dislocation adjacent a portion of a source region of the substrate;
- a second dislocation adjacent a portion of a drain region of the substrate, wherein the source region and the drain region of the substrate are adjacent to the channel region;
- a raised source region adjacent the first spacer and on the source region;
- a raised drain region adjacent the second spacer and on the drain region, wherein at least a portion of one of the raised source region and the raised drain region provides a free surface located higher than at least a portion of the channel region and higher than at least a portion of the gate dielectric.
5 more elements
Dependencies are inferred from the claim text.