Semiconductor Device and Method of Manufacturing the Same
AssigneeRenesas Electronics Corporation
InventorSouichirou Iguchi
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AssigneeRenesas Electronics Corporation
InventorSouichirou Iguchi
Estimating the term…
To satisfy both suppression of rise in contact resistance and improvement of breakdown voltage near the end part of a trench part. The trench part GT is provided between a source offset region and a drain offset region at least in plan view in a semiconductor layer, and is provided in a source-drain direction from the source offset region toward the drain offset region in plan view. A gate insulating film GI covers the side surface and the bottom surface of the trench part GT. A gate electrode is provided in the trench part at least in plan view, and contacts the gate insulating film GI. A contact GC contacts the gate electrode GE. The contact GC is disposed, shifted in a first direction perpendicular to the source-drain direction relative to the centerline in the trench part GT extending in the source-drain direction in plan view, and is provided in the trench part GT in plan view.
1-22. (canceled)
A semiconductor device, comprising:
Dependencies are inferred from the claim text.