Semiconductor device and a method of manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorsYasuhiro ISOBE, Naoharu SUGIYAMA
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AssigneeKabushiki Kaisha Toshiba
InventorsYasuhiro ISOBE, Naoharu SUGIYAMA
Estimating the term…
A semiconductor device includes a silicon substrate, a multi-layered film formed on the silicon substrate, the multi-layered film including a first aluminum nitride containing layer, a second aluminum nitride containing layer, and a film stack having a super lattice structure in which, between the first aluminum nitride containing layer and the second aluminum nitride containing layer, at least two layers selected from a group of layers including an aluminum nitride containing layer, a gallium nitride containing layer and an aluminum gallium nitride containing layer are alternately disposed between the first aluminum nitride containing layer and the second aluminum nitride containing layer, and a first gallium nitride containing layer formed on the multi-layered film.
A semiconductor device comprising:
A method of manufacturing a semiconductor device comprising the steps of:
A nitride compound semiconductor device, comprising:
Dependencies are inferred from the claim text.