Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsKohei OASA, Akira YOSHIOKA, Yasuhiro ISOBE
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AssigneeKabushiki Kaisha Toshiba
InventorsKohei OASA, Akira YOSHIOKA, Yasuhiro ISOBE
Estimating the term…
A semiconductor device includes a first semiconductor layer, a second semiconductor layer over the first semiconductor layer, source and drain electrodes over the second semiconductor layer, a gate electrode, and a first field plate electrode. The second semiconductor layer includes a first semiconductor portion and a second semiconductor portion thinner than the first semiconductor portion. The source and drain electrodes are electrically connected to the second semiconductor layer. The gate electrode is provided over the second semiconductor layer between the source electrode and the drain electrode. The first field plate electrode is provided over the second semiconductor layer and includes a portion that extends from a location over the gate electrode toward the drain electrode and has an end portion that is positioned over the second semiconductor portion.
A semiconductor device comprising:
A method of manufacturing a compound semiconductor device, comprising:
A nitride semiconductor device, comprising:
Dependencies are inferred from the claim text.