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US 2016/0079296 A1Published application
Solid-state image sensor and electronic device
AssigneeSony Corporation
InventorToshifumi Wakano
Life of this patent
Estimating the term…
Abstract
There is provided a solid-state image sensor including a semiconductor substrate in which a plurality of pixels are arranged, and a wiring layer stacked on the semiconductor substrate and formed in such a manner that a plurality of conductor layers having a plurality of wirings are buried in an insulation film. In the wiring layer, wirings connected to the pixels are formed of two conductor layers.
Claims11
A solid-state image sensor comprising:
- a semiconductor substrate in which a plurality of pixels are arranged;
- and
- a wiring layer stacked on the semiconductor substrate and formed in such a manner that a plurality of conductor layers having a plurality of wirings are buried in an insulation film,
- wherein, in the wiring layer, wirings connected to the pixels are formed of two conductor layers.
1 more element
An electronic device including a solid-state image sensor, the electronic device comprising:
- a semiconductor substrate in which a plurality of pixels each having a photoelectric conversion element are arranged;
- and
- a wiring layer stacked on the semiconductor substrate and formed in such a manner that a plurality of conductor layers having a plurality of wirings are buried in an insulation film,
- wherein, in the wiring layer, wirings connected to the pixels are formed of two conductor layers.
1 more element
Dependencies are inferred from the claim text.