Image pickup device and method of manufacturing the same
AssigneeRenesas Electronics Corporation
InventorsTakahiro TOMIMATSU, Takeshi KAMINO, Takeshi KAWAMURA
Life of this patent
Estimating the term…
Loading patent…
AssigneeRenesas Electronics Corporation
InventorsTakahiro TOMIMATSU, Takeshi KAMINO, Takeshi KAWAMURA
Estimating the term…
To prevent deterioration in the sensitivity of a pixel part caused by variation in the distance between a waveguide and a photo diode and by decay of light due to suppression of reflection of entering light. In a pixel region, there is formed a waveguide which penetrates through a fourth interlayer insulating film or the like and reaches a sidewall insulating film. The sidewall insulating film is configured to have a stacked structure of a silicon oxide film and a silicon nitride film. The waveguide is formed so as to penetrate through even the silicon nitride film of the sidewall insulating film and to reach the silicon oxide film of the sidewall insulating film, or so as to reach the silicon nitride film of the sidewall.
An image pickup device, comprising:
Dependencies are inferred from the claim text.