Infrared sensor
AssigneeKabushiki Kaisha Toshiba
InventorsKoichi ISHII, Hideyuki Funaki
Life of this patent
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Abstract
An infrared sensor according to an embodiment includes a housing, a detector, a lid, and a light shielding film. The detector is mounted on the bottom surface of the housing and includes a heat-sensitive pixel region and a reference pixel region. The lid seals the housing and includes a support member and a window member. The support member is bonded to the side surfaces of the housing and has an opening positioned above the heat-sensitive pixel region. The window member is bonded to a surface of the support member on a side of the detector so as to cover the opening. The light shielding film is formed on a surface of the window member on a side of the detector and arranged on an optical path of the infrared rays entering the reference pixel region.
Claims11
An infrared sensor comprising:
- a housing having a bottom surface and side surfaces;
- a detector mounted on the bottom surface of the housing including:
- a heat-sensitive pixel region having a plurality of heat-sensitive pixels of which an output voltage changes when infrared rays are received;
- and
- a reference pixel region having at least one reference pixel of which output voltage changes are smaller than those of the heat-sensitive pixel while receiving the infrared rays;
- a lid sealing the housing including:
- a support member which is bonded to the side surfaces of the housing and has an opening positioned above the heat-sensitive pixel region and;
- a window member which is bonded to a surface of the support member on a side of the detector so as to cover the opening;
- and
- a light shielding film formed on a surface of the detector on a side of the window member and arranged on an optical path of the infrared rays entering the reference pixel region.
Dependencies are inferred from the claim text.