Method for mounting chip on printed circuit board
AssigneeSunASIC Technologies, Inc.
InventorsChi-Chou LIN, Zheng-Ping HE
Life of this patent
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Abstract
A method for mounting a chip on a printed circuit board (PCB) is disclosed. The method includes the steps of: providing a chip having a plurality of bonding pads and a PCB having a recess portion and a plurality of connectors; gluing the recess portion; placing the chip into the recess portion; and forming circuit patterns linking associated bonding pad and connector. A bottom of the recess portion is substantially flat and a shape of the recess portion is similar to that of the chip but large enough so that the chip can be fixed in the recess portion after being glued.
Claims13
A method for mounting a chip on a printed circuit board (PCB), comprising the steps of:
- providing a chip having a plurality of bonding pads and a PCB having a recess portion and a plurality of connectors;
- adding glue into the recess portion;
- placing the chip into the recess portion of the PCB;
- and
- linking the bonding pads to the connectors of the PCB by inkjet printing or screen printing to form circuit patterns,
- wherein a bottom of the recess portion is substantially flat and a shape of the recess portion is similar to that of the chip but large enough so that the chip can be fixed in the recess portion of the PCB after the glue is being added;
- and
- wherein step difference between a level of a top surface of the chip and that of the PCB after the placing the chip into the recess portion step is less than 0.1 mm.
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Dependencies are inferred from the claim text.