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US 2016/0079222 A1Published application
Semiconductor device having terminals formed on a chip package including a plurality of semiconductor chips and manufacturing method thereof
AssigneeKabushiki Kaisha Toshiba
InventorTakao SATO
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Abstract
A semiconductor device includes a chip package including plurality of stacked semiconductor chips, a sealing layer covering at least an upper surface of the chip package, a plurality of first conductive elements disposed on the chip package and exposed on an upper surface of the sealing layer, and a plurality of second conductive elements, each being disposed on one of the exposed surfaces of the first conductive elements.
Claims20
A semiconductor device comprising:
- a chip package including plurality of stacked semiconductor chips;
- a sealing layer covering at least an upper surface of the chip package;
- a plurality of first conductive elements disposed on the chip package and exposed on an upper surface of the sealing layer;
- and
- a plurality of second conductive elements, each being disposed on one of the exposed surfaces of the first conductive elements.
2 more elements
A method for manufacturing a semiconductor device, comprising:
- forming a chip package including plurality of stacked semiconductor chips;
- forming a plurality of first conductive elements on the chip package;
- forming a sealing layer that covers at least an upper surface of the chip package;
- removing an upper portion of the sealing layer and an upper portion of each first conductive elements, such that an upper surface of the sealing layer and upper surfaces of the first conductive elements exposed thereon form a flat surface;
- and
- forming a plurality of second conductive elements, each on one of the exposed surfaces of the first conductive elements.
3 more elements
A method for manufacturing a semiconductor device, comprising:
- forming a chip package including plurality of stacked semiconductor chips;
- forming a sealing layer that covers at least an upper surface of the chip package;
- forming a plurality of openings that penetrates the sealing layer;
- forming a plurality of first conductive elements in the openings;
- removing an upper portion of the sealing layer and an upper portion of each first conductive elements, such that an upper surface of the sealing layer and upper surfaces of the first conductive elements exposed thereon form a flat surface;
- and
- forming a plurality of second conductive elements, each on one of the exposed surfaces of the first conductive elements.
4 more elements
Dependencies are inferred from the claim text.