Semiconductor light emitting device and lead frame
AssigneeKabushiki Kaisha Toshiba
InventorsHidenori Egoshi, Yoshio Noguchi, Kazuhiro Inoue, Takashi Arakawa, Teruo Takeuchi, Toshihiro Kuroki, Masahiro Ogushi
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AssigneeKabushiki Kaisha Toshiba
InventorsHidenori Egoshi, Yoshio Noguchi, Kazuhiro Inoue, Takashi Arakawa, Teruo Takeuchi, Toshihiro Kuroki, Masahiro Ogushi
Estimating the term…
According to one embodiment, a semiconductor light emitting device includes a lead frame; a chip mounted on the lead frame, the chip including a substrate and a light emitting element provided on the substrate; a wall section including an inner wall facing to a side portion of the chip, and an outer wall on an opposite side to the inner wall; and a phosphor layer provided on at least the chip. A distance between the side portion of the chip and the inner wall of the wall section is smaller than a thickness of the chip. An angle between an upper surface of the lead frame and the inner wall is smaller than an angle between the upper surface of the lead frame and the outer wall.
A semiconductor light emitting device comprising:
A semiconductor light emitting device comprising:
A lead frame comprising:
Dependencies are inferred from the claim text.