Bva interposer

A microelectronic package comprising:

• a dielectric encapsulation having first and second oppositely-facing surfaces;
• a plurality of wire bonds extending between the first and second surfaces, each wire bond having first and second opposite ends at the respective first and second surfaces, and an edge surface between the first and second ends contacted by the encapsulation and separated from the edge surfaces of adjacent wire bonds by the encapsulation;
• a redistribution structure having one or more layers overlying the first or second surface of the encapsulation and including a plurality of electrically conductive traces extending in one or more lateral directions substantially parallel to the first surface, the traces electrically connected to the first or second ends of at least some of the wire bonds;
• a microelectronic element having a front surface having element contacts thereat electrically connected with at least some of the electrically conductive traces, a rear surface opposite the front surface, and edge surfaces extending between the front and rear surfaces, the microelectronic element disposed at least partially within the dielectric encapsulation, with the edge surfaces at least partially covered by the dielectric encapsulation.

A microelectronic package comprising:

• a dielectric encapsulation having first and second oppositely-facing surfaces;
• a plurality of wire bonds extending between the first and second surfaces, each wire bond having first and second opposite ends at the respective first and second surfaces, and an edge surface between the first and second ends contacted by the encapsulation and separated from the edge surfaces of adjacent wire bonds by the encapsulation;
• a first redistribution structure having one or more layers overlying the first surface of the encapsulation and including a plurality of first electrically conductive traces extending in one or more lateral directions substantially parallel to the first surface, the first traces electrically connected to the first ends of at least some of the wire bonds;
• a second redistribution structure having one or more layers overlying the second surface of the encapsulation and including a plurality of second electrically conductive traces extending in the one or more lateral directions, the second traces electrically connected to the second ends of at least some of the wire bonds;
• a microelectronic element having a front surface having element contacts thereat electrically connected with at least some of the electrically conductive traces, a rear surface opposite the front surface, and edge surfaces extending between the front and rear surfaces, the microelectronic element disposed at least partially within the dielectric encapsulation, with the edge surfaces at least partially covered by the dielectric encapsulation.