Method for manufacturing light-emitting device

A method for manufacturing a light-emitting device in which a plurality of chips are housed in a single package, characterized by including:

• a first arrangement step in which, in a cavity circuit substrate on which light-emitting elements are mounted in a plurality of cavities that open upward, solid-state first sealing resin containing a phosphor is arranged in one of at least two of the cavities that form one package;
• a second arrangement step in which solid-state second sealing resin that is different from the first sealing resin is arranged in the other one of the at least two cavities;
• a melting step in which the first sealing resin arranged in the first arrangement step and the second sealing resin arranged in the second arrangement step are heated and thereby melted;
• and
• a curing step in which the first sealing resin and the second sealing resin melted in the melting step are cured
• in the first arrangement step and the second arrangement step, the first sealing resin and the second sealing resin being arranged in the cavities in the cavity circuit substrate such that the first sealing resin and the second sealing resin oppose each other in row units.